Microelectronic Packaging Research and Development Engineer, Day Shift Job Description Microelectronic Packaging Research and Development (R&D) Engineers with the Wafer Assembly Technology Development (WATD) team, provide on shift sustaining support for integrated circuit or semiconductor processes, project collaboration, and package design/development process feedback. Responsibilities will include, but not be limited to: * Product disposition and new product recipe creation, documentation of process issues, and data collection using area specific methods. * Supporting Assembly processes/equipment improvement, applying novel concepts in Die Prep technology solutions for next-generation Central Processing Units (CPUs) and devices. * Helping to develop innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies. In this position, you will be improving, sustaining, and co-developing processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements. Innovating, problem solving, supporting development, and continuously improving equipment and processes using experimental design and statistical methods. * Provide process and equipment specification feedback, applying principles for design of experiments and data analysis, planning and documentation of improvements through the spec/Best Known Method (BKM). * Developing solutions to problems utilizing formal education, statistical knowledge, and problem-solving tools. * Training production and process engineers for technology transfer to other factories worldwide for High Volume Manufacturing. * Willingness to work compressed Day Shift work week schedule, either Shift 5 or Shift 7, to support 24/7 business operational need. The ideal candidate should exhibit the following behavioral traits: * Technical leadership skills: Self initiative, leadership, strategic shift planning, coaching and supporting the development of a technical team. * Successfully participate in a highly matrix environment managing resources and timelines, as well as proven stakeholder management. * Flexibility in changing priorities and responsibilities to support business needs. * Tolerance for ambiguity in a fast paced, constantly changing product roadmap environment. * Action-oriented by influencing, communication skills and work independently. This is an entry level position and compensation will be given accordingly. Qualifications You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences. For information on Intel's immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information<https://www.intel.com/content/www/us/en/jobs/hiring.html>. Minimum Qualifications: * Possess a Bachelor's degree in one of the following majors: Mechanical Engineering or Material Engineering or Electrical Engineering or Physics or Chemistry or Chemical Engineering or related field. * Candidate must possess degree by employment start date. Preferred Qualifications: 3+ months of experience with one or more of the following: * Statistical Process Control (SPC)/Design of Experiments (DOE) principles. * Fabrication floor presence and manufacturing interactions. * Semiconductor fabrication processes and technology. Inside this Business Group As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth. https://jobs.intel.com/ShowJob/Id/3360742/Microelectronic-Packaging-Research... Josefine Fleetwood, (she/her) Employer Relations Manager Oregon State University | College of Engineering 116 Johnson Hall - Room 112 541-737-7286 Josefine.fleetwood@oregonstate.edu<mailto:Josefine.fleetwood@oregonstate.edu> [cid:image001.jpg@01D85FBD.8803AEB0]
